4”-8”wafer applicationThinner wafer capabilityWafer cassette loading & unloadingTape pre-cutting before laminatingRoller laminating technologyHigh precision wafer laminatingWafer intel.....

4”-8”wafer applicationThinner wafer capabilityWafer cassette loading & unloadingRobot delaminating technologyWafer intelligent mapping in cassetteBuilt-in LED UV irradiating module (Op.....

4”-8”wafer applicationThinner wafer capabilityWafer transfer robot handling waferWafer cassette loading & unloadingVacuum laminating technologyHigh temperature controlESD controlDouble.....

8”-12”wafer applicationESD roller tapingWafer transfer robot handling waferLoadport loading & unloadingWafer intelligent mapping in cassetteNon-contact wafer aligningPC based control w.....

4”-8”wafer applicationFully auto taping & detapingSolo taping or detaping capabilitySynchro taping & detaping capabilityConfigure with dual arm transfer robotBernoulli arm for wafe.....

4”-8”/8”-12”wafer applicationAdvanced ESD roller tapingAutomatic tape feeding & tapingAutomatic wafer edge profile cuttingRobot peeling tapeManual wafer loading & unloa.....

4”-8”/8”-12”wafer applicationESD roller tapingAutomatic tape feeding & tapingManual wafer loading & unloadingPLC based controlNon-UV & UV tape compatibleWafer edge .....

4”-8”wafer bonding applicationThinner wafer capabilityVacuum thermal press tapeWafer cassette loading & unloadingAutomatic device wafer & support wafer aligningAutomatic bonding ta.....

4”-8”wafer applicationThinner wafer capabilityWafer cassette loading & unloadingAutomatic bonded wafer aligningThermal debonding device wafer & support waferUsed bonding tape robot.....

4”-8” / 8”-12”Wafer ApplicationFully automatic roller mountingFully automatic robot detapingThinner wafer contact or non-contact mountingConfigure with flip arm wafer transfer .....